water content

Roll up water-soluble films are packaged in PE plastic to maintain their specific moisture content.

 After the water-soluble film is removed from the PE packaging, its own moisture content changes with the environmental humidity, and its performance also changes accordingly.

Antistatic properties

Water soluble film is an anti-static film that, unlike other plastic films, has good anti-static properties.

 During the use of water-soluble film packaging products, there will be no reduction in plasticity or electrostatic dust adhesion caused by static electricity.

Moisture and gas permeability

Water soluble films have strong permeability to moisture and ammonia, but good barrier properties to oxygen, nitrogen, hydrogen, and carbon dioxide gases.

 These characteristics enable it to maintain the composition and original odor of the packaged product intact.

Heat sealing property

Water soluble packaging film has good heat sealing properties, suitable for resistance heat sealing and high-frequency heat sealing. The heat sealing strength is related to temperature, humidity, pressure, time and other conditions, generally greater than 200g/cm.

mechanical properties

The mechanical properties of water-soluble packaging film include elastic modulus of 2500-400kg/cm2, tensile strength of 400-200kg/cm2, tear force of 200-50kg/cm, and elongation of 150-220%.

printing performance

Water soluble films can be printed clearly using ordinary printing methods and have good printability.

Oil and chemical resistance

Water soluble packaging films have good oil resistance (vegetable oil, animal oil, mineral oil), fat resistance, resistance to organic solvents and carbohydrates, but strong bases, strong acids, chlorine free radicals, and other substances that can react chemically with PVA, such as borax, boric acid, certain dyes, etc. It is recommended not to package these substances with water soluble films.

water-soluble

The water solubility of water-soluble films is related to their thickness and temperature. Taking a 25 μ m thick film as an example, the dissolution time is ≤ 300S at 20 ℃, ≤ 50S at 30 ℃, and ≤ 30S at 40 ℃. (S-seconds)